Low profile build up

Flexible tile adhesive

Max Heat Transfer Symbol

High thermal insulation material

Subfloor

AmbiDeck® 20 Pro System overview

  • Thin build-up = 20 mm
  • High output unique Lozenge-shaped board design = +10% output
  • High thermal insulation material (+10% thermal value) over the traditional AmbiDeck® models
  • High flow 16 mm pipe

The AmbiDeck® 20 Pro system really does give the best of both worlds – it provides a low-profile Underfloor Heating system, which incorporates an insulation layer and can be tiled directly. AmbiDeck® 20 Pro consists of a high-density XPS insulation panel that is 20 mm thick.

The face of the panel is cement-coated, making it rigid and durable. It is grooved to take 16 mm UFH pipework, with a 150 mm radius return grooved into each panel, making the panel universal. Additional pipework channels can easily be routed/grooved into the panel.

UK Patent Pending 2402953.0

Part of our range of Low Profile Underfloor Heating.

AmbiDeck® 20 Pro Downloads and Ordering

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System Data Sheet

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AmbiDeck® 20 Pro Specification

System Type Low Profile

Sub Floor Solid + Suspended

Pipe Size 16mm

Panel size (mm) 600mm x 1200mm – 0.72m2

Pipe Centres (mm) 150

Minimum build up excluding floor finish 20mm

Output @ 0 tog, 45 degrees mean water temperature, 20 degrees room temperature 110 w/m2

Weight kg per m2 4.1 or 15.1kg with 6mm AmbiFibre Pro levelling compound

Acoustic Improvement (dB) N/A

Max m2 per loop 18m2

Heat Pump Ready Yes

UK Patent Pending 2402953.0


What’s included in the AmbiDeck® 20 Pro system

AmbiDeck® 20 Pro Panels
1200 x 600 x 20 mm (L,W,H)
Code 46173

AmbiDeck® 20 Pro Highway panels
1200 x 600 x 20 mm (L,W,H)
Code 46175

AmbiDeck® 20 Pro Cornerboard
1200 x 600 x 20 mm (L,W,H)
Code 46175

AmbiDeck® Screws
One box per 30 m2 – 9pcs per board
Code 46192

AmbiDeck® Washers
One bag per 15 m2 – 9pcs per board
Code 46195

AmbiFibre – Flexible Levelling Compound
1.7 kg per mm per m2 – Eg 6 mm thickness = 1.7kg x 6mm = 10.2 kg
Code 47510