Low profile build up
Flexible tile adhesive
High thermal insulation material
Subfloor
AmbiDeck® 20 Pro System overview
- Thin build-up = 20 mm
- High output unique Lozenge-shaped board design = +10% output
- High thermal insulation material (+10% thermal value) over the traditional AmbiDeck® models
- High flow 16 mm pipe
The AmbiDeck® 20 Pro system really does give the best of both worlds – it provides a low-profile Underfloor Heating system, which incorporates an insulation layer and can be tiled directly. AmbiDeck® 20 Pro consists of a high-density XPS insulation panel that is 20 mm thick.
The face of the panel is cement-coated, making it rigid and durable. It is grooved to take 16 mm UFH pipework, with a 150 mm radius return grooved into each panel, making the panel universal. Additional pipework channels can easily be routed/grooved into the panel.
UK Patent Pending 2402953.0
Part of our range of Low Profile Underfloor Heating.
AmbiDeck® 20 Pro Downloads and Ordering
AmbiDeck® 20 Pro Specification
System Type Low Profile
Sub Floor Solid + Suspended
Pipe Size 16mm
Panel size (mm) 600mm x 1200mm – 0.72m2
Pipe Centres (mm) 150
Minimum build up excluding floor finish 20mm
Output @ 0 tog, 45 degrees mean water temperature, 20 degrees room temperature 110 w/m2
Weight kg per m2 4.1 or 15.1kg with 6mm AmbiFibre Pro levelling compound
Acoustic Improvement (dB) N/A
Max m2 per loop 18m2
Heat Pump Ready Yes
UK Patent Pending 2402953.0
What’s included in the AmbiDeck® 20 Pro system
AmbiDeck® 20 Pro Panels
1200 x 600 x 20 mm (L,W,H)
Code 46173
AmbiDeck® 20 Pro Highway panels
1200 x 600 x 20 mm (L,W,H)
Code 46175
AmbiDeck® 20 Pro Cornerboard
1200 x 600 x 20 mm (L,W,H)
Code 46175
AmbiDeck® Screws
One box per 30 m2 – 9pcs per board
Code 46192
AmbiDeck® Washers
One bag per 15 m2 – 9pcs per board
Code 46195
AmbiFibre – Flexible Levelling Compound
1.7 kg per mm per m2 – Eg 6 mm thickness = 1.7kg x 6mm = 10.2 kg
Code 47510